Abstract
ISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead solders.
This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.
General information
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Status: Under developmentStage: International Standard under publication [60.00]
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Edition: 2
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Technical Committee :ISO/TC 44/SC 12ICS :25.160.50
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Life cycle
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PublishedISO 9455-17:2002
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