International Standard
ISO 9455-14:2017
Soft soldering fluxes — Test methods — Part 14: Assessment of tackiness of flux residues
Reference number
ISO 9455-14:2017
Edition 2
2017-08
© ISO 2024
International Standard
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Published (Edition 2, 2017)
This standard was last reviewed and confirmed in 2023. Therefore this version remains current.

ISO 9455-14:2017

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CHF 42
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Abstract

ISO 9455-14:2017 specifies a qualitative method for the assessment of the tackiness of the residues of a soft soldering flux after a soldering process. The method is applicable to all fluxes, solder pastes and flux cored solder wires. The method is particularly appropriate for applications where flux residues are left in situ on electrical and electronic equipment.

General information

  • Status
     : Published
    Publication date
     : 2017-08
    Stage
    : International Standard confirmed [90.93]
  • Edition
     : 2
    Number of pages
     : 4
  • Technical Committee :
    ISO/TC 44/SC 12
    ICS :
    25.160.50 
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