This standard was last reviewed and confirmed in 2019.
Therefore this version remains current.
Abstract
PreviewISO 16525-9:2014 specifies test methods to investigate the high-speed signal-transmission characteristics in the bonded portions of an isotropic electrically conductive adhesive, which joins the terminals of a surface mounted device (SMD) and the land grid patterns of a printed circuit board. It also investigates the characteristics of wiring with an isotropic electrically conductive adhesive, which can be applied on to the printed circuit board.
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Status: PublishedPublication date: 2014-05
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Edition: 1Number of pages: 45
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- ICS :
- 83.180 Adhesives
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| Format | Language | |
|---|---|---|
| std 1 166 | PDF + ePub | |
| std 2 166 | Paper |
- CHF166
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